一般目標(biāo)：計算粒子力學(xué)（CPM）是一本季刊，其目標(biāo)是出版涉及粒子和粒子方法的系統(tǒng)建模和模擬的完整原創(chuàng)文章。其目的是加強(qiáng)應(yīng)用科學(xué)研究人員之間的交流，這些研究人員在他們的研究中使用一種或另一種形式的“粒子”。具體目標(biāo)：基于粒子的材料和數(shù)值方法在自然科學(xué)和應(yīng)用科學(xué)、工程、生物學(xué)中得到了廣泛的應(yīng)用。“粒子方法/力學(xué)”一詞現(xiàn)在對21世紀(jì)的研究人員來說意味著幾個不同的事情，包括：（a）顆粒作為顆粒介質(zhì)、顆粒流、等離子體、蜂群等中的物理單元，（b）在中、微觀和納米尺度上連續(xù)表示材料相的粒子（c）粒子作為一個連續(xù)的離散單位，在數(shù)值方法如其中包括離散元法（DEM）、粒子有限元法（PFEM）、分子動力學(xué)（MD）和光滑粒子流體動力學(xué)（SPH）。CPM將關(guān)注上述主題。我們歡迎在各種應(yīng)用中工作，包括但不限于：（a）由高技術(shù)工業(yè)過程引起的顆粒和顆粒流動問題，例如由噴霧、沉積和印刷過程產(chǎn)生的顆粒和顆粒流問題（b）土木和海洋工程中考慮自由表面流效應(yīng)的流體-結(jié)構(gòu)相互作用問題（水射流、波浪荷載、船舶流體動力學(xué)、泥石流等）；（c）涉及固體、流體、熱、電磁和光學(xué)系統(tǒng)的耦合多物理現(xiàn)象（d）使用顆粒修改基材的材料設(shè)計/功能化，（e）涉及成形、切割、壓實(shí)、材料加工的制造工藝；（f）生物醫(yī)學(xué)工程，涉及細(xì)胞力學(xué)、分子動力學(xué)和尺度橋接，以及（g）導(dǎo)致斷裂和碎裂的沖擊。

GENERAL OBJECTIVES: Computational Particle Mechanics (CPM) is a quarterly journal with the goal of publishing full-length original articles addressing the modeling and simulation of systems involving particles and particle methods. The goal is to enhance communication among researchers in the applied sciences who use "particles'' in one form or another in their research. SPECIFIC OBJECTIVES: Particle-based materials and numerical methods have become wide-spread in the natural and applied sciences, engineering, biology. The term "particle methods/mechanics'' has now come to imply several different things to researchers in the 21st century, including: (a) Particles as a physical unit in granular media, particulate ?ows, plasmas, swarms, etc., (b) Particles representing material phases in continua at the meso-, micro-and nano-scale and (c) Particles as a discretization unit in continua and discontinua in numerical methods such as Discrete Element Methods (DEM), Particle Finite Element Methods (PFEM), Molecular Dynamics (MD), and Smoothed Particle Hydrodynamics (SPH), to name a few. CPM will focus on the above topics. We welcome works in a variety of applications including, but not limited to: (a) Particulate and granular flow problems motivated by high-tech industrial processes such as those stemming from spray, deposition and printing processes(b) Fluid-structure interaction problems accounting for free surface flow effects in civil and marine engineering (water jets, wave loads, ship hydrodynamics, debris flows, etc.), (c) Coupled multiphysical phenomena involving solid, fluid, thermal, electromagnetic and optical systems (d) Material design/functionalization using particles to modify base materials, (e) Manufacturing processes involving forming, cutting, compaction, material processing,(f) Biomedical engineering, involving cell mechanics, molecular dynamics and scale-bridging and (g) Impact resulting in fracture and fragmentation.